Module Assembly

Module Assembly

Tens to millions of SOFTCELL® can be connected in series/parallel based on customized voltages and currents depending on the application. SOFTFORM®, our proprietary circuit designed and printed flexible film, can be prepared without limitations in transparency, flexibility, and product shape. In addition, SOFTCELL® and electronic components such as micro-batteries, LEDs, resistors, capacitors, sensors, and chips can be integrated into the module and placed onto the SOFTFORM® very easily and quickly by the SMT process, the popular and reliable process in the electronics industry.

  • Prepare the PCB substrate, SOFTFORM®.
    Based on circuit design, electrical circuit patterns are printed on either a rigid laminate or a film resulting in PCB substrate, SOFTFORM®.
  • Mount SOFTCELL® & other electronic components on the SOFTFORM®. It is required to properly design series and parallel connections to supply the required voltage and current to meet specifications of target products.
  • Reflow PCB substrates with mounted SOFTCELL® & other electronic components to bond each other resulting in SOFTGOODS®.

[Schematic view of SOFTGOODS® : micro-battery, sensor, and communication chip embedded]